This technology forms a 3D device inside glass in one step, by directing a laser beam onto a hologram. By using this one-step processing technology, not only is processing time shortened by a factor of 10,000, but processing precision is improved by a factor of ten. This method can process a wide range of materials, including silicon, compound semiconductors, and plastics. The project team expects it to be effective in a broad range of fields, including MEMS processing and nano-imprinting.

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